Capacitor, method of increasing a capacitance area of same, and system containing same

ABSTRACT

A capacitor includes a substrate ( 110, 210 ), a first electrically insulating layer ( 120, 220 ) over the substrate, and a fin ( 130, 231 ) including a semiconducting material ( 135 ) over the first electrically insulating layer. A first electrically conducting layer ( 140, 810 ) is located over the first electrically insulating layer and adjacent to the fin. A second electrically insulating layer ( 150, 910 ) is located adjacent to the first electrically conducting layer, and a second electrically conducting layer ( 160, 1010 ) is located adjacent to the second electrically insulating layer. The first and second electrically conducting layers together with the second electrically insulating layer form a metal-insulator-metal stack that greatly increases the capacitance area of the capacitor. In one embodiment the capacitor is formed using what may be referred to as a removable metal gate (RMG) approach.

FIELD OF THE INVENTION

The disclosed embodiments of the invention relate generally tocapacitors, and related more particularly to fin capacitors capable ofuse in embedded memory applications.

BACKGROUND OF THE INVENTION

Today's computer chips are increasingly dependent on robust memoryarchitecture capable of quickly accessing and handling large amounts ofdata. Existing memory solutions such as off-chip physical dynamic randomaccess memory (DRAM) that sit on the mother board separate from thecomputer chip require relatively large amounts of energy and suffer fromhigh latency, resulting in power-performance loss. Latency problems havebeen addressed using 1T-1C DRAM cells embedded on the computer chip, butexisting versions of such DRAM cells are frequently unable to meetever-increasing capacitance demands. Accordingly, there exists a needfor a large-size, high-density capacitor compatible with a 1T-1Cembedded DRAM cell usable within a logic technology process.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosed embodiments will be better understood from a reading ofthe following detailed description, taken in conjunction with theaccompanying figures in the drawings in which:

FIG. 1 is a cross-sectional view of a capacitor according to anembodiment of the invention;

FIG. 2 is a cross-sectional view of a tri-gate memory cell at aparticular point in its manufacturing process according to an embodimentof the invention;

FIG. 3 is a flowchart illustrating a method of increasing a capacitancearea of a tri-gate memory cell according to an embodiment of theinvention;

FIGS. 4-11 are cross-sectional views of the tri-gate memory cell of FIG.2 at different points in its manufacturing process according to anembodiment of the invention;

FIG. 12 is a cross-sectional view of a capacitor according to adifferent embodiment of the invention; and

FIG. 13 is a schematic representation of a system including a capacitoraccording to an embodiment of the invention.

For simplicity and clarity of illustration, the drawing figuresillustrate the general manner of construction, and descriptions anddetails of well-known features and techniques may be omitted to avoidunnecessarily obscuring the discussion of the described embodiments ofthe invention. Additionally, elements in the drawing figures are notnecessarily drawn to scale. For example, the dimensions of some of theelements in the figures may be exaggerated relative to other elements tohelp improve understanding of embodiments of the present invention. Thesame reference numerals in different figures denote the same elements.

The terms “first,” “second,” “third,” “fourth,” and the like in thedescription and in the claims, if any, are used for distinguishingbetween similar elements and not necessarily for describing a particularsequential or chronological order. It is to be understood that the termsso used are interchangeable under appropriate circumstances such thatthe embodiments of the invention described herein are, for example,capable of operation in sequences other than those illustrated orotherwise described herein. Similarly, if a method is described hereinas comprising a series of steps, the order of such steps as presentedherein is not necessarily the only order in which such steps may beperformed, and certain of the stated steps may possibly be omittedand/or certain other steps not described herein may possibly be added tothe method. Furthermore, the terms “comprise,” “include,” “have,” andany variations thereof, are intended to cover a non-exclusive inclusion,such that a process, method, article, or apparatus that comprises a listof elements is not necessarily limited to those elements, but mayinclude other elements not expressly listed or inherent to such process,method, article, or apparatus.

The terms “left,” “right,” “front,” “back,” “top,” “bottom,” “over,”“under,” and the like in the description and in the claims, if any, areused for descriptive purposes and not necessarily for describingpermanent relative positions. It is to be understood that the terms soused are interchangeable under appropriate circumstances such that theembodiments of the invention described herein are, for example, capableof operation in other orientations than those illustrated or otherwisedescribed herein. The term “coupled,” as used herein, is defined asdirectly or indirectly connected in an electrical or non-electricalmanner. Objects described herein as being “adjacent to” each other maybe in physical contact with each other, in close proximity to eachother, or in the same general region or area as each other, asappropriate for the context in which the phrase is used.

DETAILED DESCRIPTION OF THE DRAWINGS

In one embodiment of the invention, a capacitor comprises a substrate, afirst electrically insulating layer over the substrate, and a fincomprising a semiconducting material over the first electricallyinsulating layer. A first electrically conducting layer is located overthe first electrically insulating layer and adjacent to the fin. Asecond electrically insulating layer is located adjacent to the firstelectrically conducting layer, and a second electrically conductinglayer is located adjacent to the second electrically insulating layer.The first and second electrically conducting layers together with thesecond electrically insulating layer form a metal-insulator-metal stackthat greatly increases the capacitance area of the capacitor.

Referring now to the figures, FIG. 1 is a cross-sectional view of acapacitor 100 according to an embodiment of the invention. Asillustrated in FIG. 1, capacitor 100 comprises a substrate 110, anelectrically insulating layer 120 over substrate 110, and a fin 130comprising a semiconducting material 135 over electrically insulatinglayer 120. As an example, electrically insulating layer 120 can be anoxide slab having a surface 121. As another example, semiconductingmaterial 135 can be silicon (Si), germanium (Ge), silicon germanium(SiGe), a III-V material such as gallium arsenide (GaAs), or the like.As yet another example, fin 130 can extend at least part way intoelectrically insulating layer 120. In one embodiment, for example, fin130 has a portion 131 extending into electrically insulating layer 120and a portion 132 protruding from surface 121 of electrically insulatinglayer 120. In the illustrated embodiment, portion 131 extends all theway through electrically insulating layer 120 and into substrate 110. Inthe same or another embodiment, fin 130 can be degenerately doped downto or below surface 121, and/or can be made electrically conductingthrough silicidation or the like.

Capacitor 100 further comprises an electrically conducting layer 140over electrically insulating layer 120 and adjacent to fin 130, anelectrically insulating layer 150 adjacent to electrically conductinglayer 140, and an electrically conducting layer 160 adjacent toelectrically insulating layer 150. An inter-layer dielectric (ILD) 170is over electrically insulating layer 120 and at least partiallysurrounds fin 130. In a non-illustrated embodiment, capacitor 100 may bea decoupling capacitor. In the illustrated embodiment, capacitor 100comprises a tri-gate storage capacitor, with the three gates located atthe three interfaces between a face of fin 130 and an adjacent portionof electrically conducting layer 140, that may be used along with atri-gate transistor as part of a 1T-1C DRAM cell. Such an arrangementwill be further discussed below.

In one embodiment, electrically insulating layer 150 comprises a high-kdielectric material such as hafnium oxide (HfO₂), zirconium oxide(ZrO₂), lanthanum oxide (LnO₂), or the like, including combinationsand/or laminates thereof, each of which have dielectric constants ofapproximately 20 to approximately 40. Compare this to silicon dioxidewhich was for many years widely used as a gate dielectric material andwhich has a dielectric constant (κ) of approximately 3.9. (Although thedielectric constant is often represented by the Greek letter κ, it isusually the lower case Roman letter “k” that is used in such phrases as“high-k dielectric material,” and that convention will be followedhere.) The dielectric constant of a vacuum, which is used as a scalereference point, is defined as 1. Accordingly, any material having adielectric constant greater than about 5 or 10 would likely properly beconsidered a high-k material.

Existing DRAM capacitors based on tall fin architecture arecharacterized by a small capacitance area relative to the bitlinecapacitance that it needs to influence, and therefore requiredielectrics with very high dielectric constants—perhaps much higher thanthe values around 20 to 40 that were mentioned in the precedingparagraph. Such dielectrics do exist, as for example lead zirconiumtitanate (PZT), which may have a dielectric constant greater than 100and possibly approaching 500 or higher. Such materials, however, areoften not compatible with wafer processing techniques and temperatures.Furthermore, materials with higher dielectric constants tend to leakcharge more than those with lower dielectric constants, requiring morefrequent rewriting or refreshing of the charge. Accordingly, althoughhigh-k dielectric materials may enhance capacitor performance, suchmaterials must be carefully chosen in order to avoid problems such asthose mentioned in this paragraph.

In at least one embodiment of the present invention, a capacitor'scapacitance area is increased so that the capacitor is able to properlyinfluence its bitline capacitance using a material having a dielectricconstant large enough that it may properly be considered a high-kmaterial but not so large that it is likely to lead to processing orcharge refresh problems. As an example, capacitor 100 has an increasedcapacitance area that follows a linear distance marked by a length ofelectrically insulating layer 150. Such a capacitance area is greatlyenhanced over that of a capacitor in which the metal-insulator-metal(MIM) stack is confined to the immediate region around fin 130, or to asimilarly modest area.

Referring still to FIG. 1, electrically conducting layer 140 comprises asection 141 at a first side of fin 130 and a section 142 at an opposingsecond side of fin 130. An outside edge of section 141 and an outsideedge of section 142 are separated by a distance 145. Portion 132 of fin130 has a surface 137, and surface 137 and surface 121 are separated bya distance 139 which, in one embodiment (though not necessarily theembodiment depicted in FIG. 1), is between approximately six times andapproximately twelve times greater than distance 145. Similarly,electrically conducting layer 160 has a surface 161, and surface 137 andsurface 161 are separated by a distance 165. In one embodiment, distance165 is at least approximately equal to distance 145 and may be up toapproximately twice as great as distance 145. In the same or anotherembodiment, distance 139 is approximately five times greater thandistance 165. Increasing the magnitude of distance 145 while keeping thedistance ratios mentioned above may lead to improved performance forcapacitor 100. More specifically, such improved performance may come asa result of an increased capacitance area, i.e., the amount of surfacearea available for the capacitor, as mentioned above. The capacitancearea, and hence the capacitance, of capacitor 100 may be increased by,for example, increasing one or both of distances 139 and 165. In oneembodiment, such an increase in distances 139 and/or 165 may beaccomplished by opening up a hole at the level of metal 2 and thenetching down through various films to surface 137 and then down tosurface 121.

In one embodiment, electrically insulating layer 120 comprises anelectrically insulating material, and in the same or another embodiment,electrically conducting layer 140 comprises an electrically conductingmaterial. (In another embodiment electrically conducting layer 140 cancomprise a semiconducting material.) In one embodiment, as mentionedabove, the electrically insulating material of electrically insulatinglayer 120 is an oxide material. In the same or another embodiment, theelectrically conducting material of electrically conducting layer 140can be a metal having a work function that lies approximately mid-waybetween a conductive band and a valence band of the oxide or otherelectrically insulating material of electrically insulating layer 120. Amaterial having a work function as described may be used to controlleakage. As an example, the metal can be titanium nitride (TiN),tantalum nitride (TaN), or the like.

In one embodiment, electrically conducting layer 160 comprises anelectrically conducting material that is the same as the electricallyconducting material making up electrically conducting layer 140. In adifferent embodiment, however, electrically conducting layer 160comprises an electrically conducting material that is different from theelectrically conducting material making up electrically conducting layer140. Using different electrically conducting materials may be desirablewhen, to take one example, processing issues dictate that one of theelectrically conducting materials be more etchable than the otherelectrically conducting material.

FIG. 2 is a cross-sectional view of a tri-gate memory cell 200 at aparticular point in its manufacturing process according to an embodimentof the invention. As illustrated in FIG. 2, tri-gate memory cell 200comprises a substrate 210, an electrically insulating layer 220 oversubstrate 210, and a tri-gate capacitor 230 and a tri-gate transistor240, which may be either an access or a logic transistor, overelectrically insulating layer 220. Tri-gate capacitor 230 has asemiconducting fin 231. As an example, substrate 210, electricallyinsulating layer 220, and semiconducting fin 231 can be similar to,respectively, substrate 110, electrically insulating layer 120, and fin130, all of which are shown in FIG. 1. Tri-gate transistor 240 has asemiconducting fin 241 which may be similar to semiconducting fin 231. Apolysilicon region 235 at least partially surrounds tri-gate capacitor230, and a polysilicon region 245 at least partially surrounds tri-gatetransistor 240. Tri-gate capacitor 230 and tri-gate transistor 240 areat least partially surrounded by an ILD 270. As an example, ILD 270 canbe similar to ILD 170, shown in FIG. 1.

FIG. 3 is a flowchart illustrating a method 300 of increasing acapacitance area of a tri-gate memory cell according to an embodiment ofthe invention, where the tri-gate memory cell comprises a substrate, afirst electrically insulating layer over the substrate, and a tri-gatecapacitor and a tri-gate transistor over the first electricallyinsulating layer, and where the tri-gate capacitor has a firstsemiconducting fin. As an example, the tri-gate capacitor can be similarto tri-gate capacitor 230 and the tri-gate transistor can be similar totri-gate transistor 240, both of which are shown in FIG. 2. As anotherexample, the first semiconducting fin can be similar to semiconductingfin 231, also shown in FIG. 2.

A step 310 of method 300 is to deposit an inter-layer dielectric havingan inter-layer dielectric surface over the first electrically insulatinglayer and around the tri-gate capacitor and the tri-gate transistor. Asan example, the inter-layer dielectric can be similar to inter-layerdielectric 270, shown in FIG. 2. Following the performance of step 310,the tri-gate memory cell is similar to tri-gate memory cell 200 as it isdepicted in FIG. 2.

A step 320 of method 300 is to form a trench in the inter-layerdielectric in which at least a portion of the first semiconducting finis exposed. The processing steps that form the trench may differ fromone embodiment to another, and such processing differences may depend atleast in part on the material that is adjacent to the exposed portion ofthe semiconducting fin. In the embodiment illustrated in FIG. 2, forexample, semiconducting fin 231 is at least partially enclosed, asmentioned above, by an electrically conducting material such aspolysilicon. In that embodiment, and as illustrated in FIGS. 4-7,described below, the trench may be formed by first removing a portion ofthe inter-layer dielectric, using a polishing step for example, in orderto expose a surface of the electrically conducting material, and theelectrically conducting material may then be removed in order to formthe trench.

As an example, the exposed surface of the electrically conductingmaterial can be similar to a surface 410, first shown in FIG. 4, whichis a cross-sectional view of tri-gate memory cell 200 at a particularpoint in its manufacturing process according to an embodiment of theinvention. In one embodiment, removing the electrically conductingmaterial in order to form the trench comprises depositing anelectrically insulating film over the inter-layer dielectric surface,defining an opening for the tri-gate capacitor, thereby exposing aportion of the electrically insulating film, and removing the portion ofthe electrically insulating film. These steps place tri-gate memory cell200 in a condition where the electrically conducting material may beremoved without adversely affecting other portions of tri-gate memorycell 200. For example, these and other possible steps protectpolysilicon region 245 around transistor 240 such that the polysiliconin polysilicon region 245 is not removed.

Referring still to FIG. 4, the electrically insulating film can besimilar to an electrically insulating film 420 which, as an example, canbe a layer of nitride, oxide, or the like. In one embodiment, anotherinsulating film (not shown) may be deposited above electricallyinsulating film 420 in order to provide etch selectivity between layers.

FIGS. 5-7 are a cross-sectional views of tri-gate memory cell 200 atparticular points in its manufacturing process according to anembodiment of the invention. As illustrated in FIG. 5, the opening forthe tri-gate capacitor may be defined and the portion of theelectrically insulating film may be exposed by a lithography process inwhich a resist layer 510 is formed over electrically insulating film 420except over a portion 521. The lithography is necessary because thetri-gate transistor needs to be protected from the polysilicon etch.

In FIG. 6, portion 521 (see FIG. 5) of electrically insulating film 420has been removed and the electrically conducting material, i.e.,polysilicon region 235, is in position for removal. FIG. 7 depictstri-gate memory cell 200 after polysilicon region 235 has been removedand resist layer 510 has been stripped away so as to form a trench 710in tri-gate memory cell 200. In one embodiment, polysilicon region 235may be removed by etching the electrically conducting material. As anexample, a wet etch such as ammonium hydroxide, tetramethylammoniumhydroxide (TMAH), or the like may be used.

A step 330 of method 300 is to conformally deposit a first metal layerover the inter-layer dielectric surface and the electrically insulatingfilm, in the trench, and over the first semiconducting fin. The firstmetal layer comprises a first metal that makes ohmic contact with thesemiconducting fin, and that acts as the bottom electrode of thetri-gate capacitor. As an example, the first metal layer can be similarto electrically conducting layer 140, shown in FIG. 1. As anotherexample, the first metal layer can be similar to a metal layer 810,first shown in FIG. 8 which is a cross-sectional view of tri-gate memorycell 200 at a particular point in its manufacturing process according toan embodiment of the invention. As an example, the deposition of step330 may comprise an electroless deposition, a chemical vapor deposition(CVD) or CVD-like process, an atomic layer deposition (ALD), or thelike. In one embodiment, step 330 comprises conformally depositing alayer comprising a metal having a work function that lies approximatelymid-way between a conductive band and a valence band of an electricallyinsulating material that makes up the first electrically insulatinglayer.

A step 340 of method 300 is to conformally deposit a second electricallyinsulating layer over the first metal layer. As an example, the secondelectrically insulating layer can be similar to electrically insulatinglayer 150, shown in FIG. 1. As another example, the second electricallyinsulating layer can be similar to an electrically insulating layer 910,first shown in FIG. 9 which is a cross-sectional view of tri-gate memorycell 200 at a particular point in its manufacturing process according toan embodiment of the invention. In one embodiment, step 340 comprisesconformally depositing a high-k dielectric material.

A step 350 of method 300 is to conformally deposit a second metal layerover the second electrically insulating layer. The second metal layercomprises a second metal that acts as the top electrode of the tri-gatecapacitor. In one embodiment, the second metal layer fills orsubstantially fills the trench. As an example, the second metal layercan be similar to electrically conducting layer 160, shown in FIG. 1. Asanother example, the second metal layer can be similar to a metal layer1010, first shown in FIG. 10 which is a cross-sectional view of tri-gatememory cell 200 at a particular point in its manufacturing processaccording to an embodiment of the invention. In one embodiment, step 350comprises conformally depositing a layer comprising the first metal suchthat the first and second metal layers are made up of the same material.In a different embodiment, the metal making up the second metal layer isdifferent from the metal making up the first metal layer.

A step 360 of method 300 is to remove portions of one or more of thefirst metal layer, the second electrically insulating layer, the secondmetal layer, and the electrically insulating film. As an example, step360 places tri-gate memory cell 200 in a condition such as thatillustrated in FIG. 11, in which the MIM stack made up of metal layer810, electrically insulating layer 910, and metal layer 1010 is just intrench 710 and not on ILD 270. As an example, step 360 may beaccomplished using an etching or a polishing operation as known in theart.

In one embodiment, step 360 comprises creating an upper extremity of thesecond electrically insulating layer, and method 300 further comprisesrecessing the second metal layer below the upper extremity of the secondelectrically insulating layer. As an example, the upper extremity of thesecond electrically insulating layer can be similar to a surface 1111,first shown in FIG. 11, of electrically insulating layer 910. As anexample, the second metal layer may be recessed below the upperextremity of the second electrically insulating layer in order toprevent unwanted electrical contact that may otherwise occur between thefirst and second metal layers.

A step 370 of method 300 is to adjust a height of the firstsemiconducting fin. Step 370 is an optional step that may in someembodiments not be performed. In an embodiment where step 370 isperformed, a surface of the first electrically insulating layer is afirst surface, the semiconducting fin has a second surface, the secondelectrically conducting layer has a third surface, a width of the trenchis a first distance, a distance between the first surface and the secondsurface is a second distance, and a distance between the second surfaceand the third surface is a third distance. As an example, the firstsurface, the second surface, and the third surface can be similar to,respectively, surface 121, surface 137, and surface 161, all of whichare shown in FIG. 1, and the first distance, the second distance, andthe third distance can be similar to, respectively, distance 145,distance 139, and distance 165, all of which are also shown in FIG. 1.In one embodiment, step 370 comprises causing the height of the firstsemiconducting fin, i.e., the second distance, to be betweenapproximately six times and approximately twelve times greater than thefirst distance. Step 370 may be followed by the formation of contacts tothe tri-gate capacitor and the tri-gate transistor, and furtherprocessing steps as known in the art.

In an embodiment that is an alternative to the embodiment that has justbeen described, the ILD fills the region that in the foregoingembodiment was occupied by polysilicon, and in this alternativeembodiment polysilicon is only present around the tri-gate transistorand not around the tri-gate capacitor. In this alternate embodiment thewet etch to remove polysilicon is not needed and is replaced by a dryetch of the oxide or other material making up the ILD. The other stepsof method 300 may be used in this alternate embodiment without changefrom the way they are set forth in the previously-described embodiment.A possible advantage of the embodiment described in this paragraph

is that compared to other embodiments described herein it results in agreater amount of lateral space (equivalent to dimension 145 in FIG. 1)in which to fill in the various layers and portions of the capacitor,such as layers 140, 150, and 160, shown in FIG. 1 and described above.

FIG. 12 is a cross-sectional view of a capacitor 1200 according to adifferent embodiment of the invention. As illustrated in FIG. 12,capacitor 1200 comprises a substrate 1210, an electrically insulatinglayer 1220 over substrate 1210, and a fin 1230 comprising asemiconducting material 1235 over electrically insulating layer 1220. Asillustrated, fin 1230 is located immediately adjacent to a sidewall 1241of a trench 1201 in which capacitor 1200 is formed, rather than beingspaced apart from the trench sidewalls as was the case for capacitor 100shown in FIG. 1. In the illustrated embodiment, the capacitor space isconcentrated on the right-hand side of fin 1230. (In a differentembodiment, fin 1230 could be moved so as to be immediately adjacent tothe opposite sidewall of trench 1201, in which case the capacitor spacewould be concentrated to the left-hand side of fin 1230.)

Capacitor 1200 may be constructed in the same manner as that describedabove for capacitor 100 by making appropriate adjustments to theplacement of the resist layer as readily understand by one of ordinaryskill in the art. The construction of capacitor 1200 may be easier thanthat for capacitor 100 because the layout of capacitor 1200 providesmore margin for the metal fills. Both capacitors 100 and 1200 requirethat five layers be fit into their respective trenches. Yet for equaltrench widths (the trench widths are represented by distance 145 (seeFIG. 1) for capacitor 100 and by a width 1245 (see FIG. 12) forcapacitor 1200), the narrowest part (represented by a width 1247 in FIG.12) of trench 1200 may easily be seen to be significantly wider than thenarrowest part (unlabeled) of the capacitor 100 trench in FIG. 1.

As an example, electrically insulating layer 1220 can be an oxide slabhaving a surface 1221. As another example, semiconducting material 1235can be silicon (Si), germanium (Ge), silicon germanium (SiGe), a III-Vmaterial such as gallium arsenide (GaAs), or the like. As yet anotherexample, fin 1230 can extend at least part way into electricallyinsulating layer 1220. In one embodiment, for example, fin 1230 has aportion 1231 extending into electrically insulating layer 1220 and aportion 1232 protruding from surface 1221 of electrically insulatinglayer 1220. In the illustrated embodiment, portion 1231 extends all theway through electrically insulating layer 1220 and into substrate 1210.In the same or another embodiment, fin 1230 can be degenerately dopeddown to or below surface 1221, and/or can be made electricallyconducting through silicidation or the like.

Capacitor 1200 further comprises an electrically conducting layer 1240over electrically insulating layer 1220 and adjacent to fin 1230, anelectrically insulating layer 1250 adjacent to electrically conductinglayer 1240, and an electrically conducting layer 1260 adjacent toelectrically insulating layer 1250. An ILD 1270 is over electricallyinsulating layer 1220 and at least partially surrounds fin 1230. In anon-illustrated embodiment, capacitor 1200 may be a decouplingcapacitor. As was also the case for capacitor 100, capacitor 1200 may beused along with a tri-gate transistor as part of a 1T-1C DRAM cell. Suchan arrangement was discussed in more detail above. However, like FIG. 1,FIG. 12 does not show the tri-gate transistor.

FIG. 13 is a schematic representation of a system 1300 including acapacitor according to an embodiment of the invention. As illustrated inFIG. 13, system 1300 comprises a board 1310, a processing device 1320disposed on board 1310, and a memory device 1330 disposed on and coupledto processing device 1320. Memory device 1330 comprises a capacitor1331. As an example, capacitor 1331 can be similar to capacitor 100,shown in FIG. 1. Accordingly, capacitor 1331 comprises a substrate, afirst electrically insulating layer over the substrate, a fin comprisinga semiconducting material over the first electrically insulating layer,a first electrically conducting layer over the first electricallyinsulating layer and adjacent to the silicon fin, a second electricallyinsulating layer adjacent to the first electrically conducting layer,and a second electrically conducting layer adjacent to the secondelectrically insulating layer. Each of the stated components can besimilar to corresponding components of capacitor 100 and capacitor 230,described above and shown, respectively, in FIGS. 1 and 11.

In one embodiment, capacitor 1331 comprises a tri-gate storage capacitorand memory device 1330 further comprises a transistor 1332 adjacent tocapacitor 1331. Transistor 1332 can be similar to tri-gate transistor240, first shown in FIG. 2. In the same or another embodiment, memorydevice 1330 is a dynamic random access memory cell.

Although the invention has been described with reference to specificembodiments, it will be understood by those skilled in the art thatvarious changes may be made without departing from the spirit or scopeof the invention. Accordingly, the disclosure of embodiments of theinvention is intended to be illustrative of the scope of the inventionand is not intended to be limiting. It is intended that the scope of theinvention shall be limited only to the extent required by the appendedclaims. For example, to one of ordinary skill in the art, it will bereadily apparent that the capacitor and related methods and systemsdiscussed herein may be implemented in a variety of embodiments, andthat the foregoing discussion of certain of these embodiments does notnecessarily represent a complete description of all possibleembodiments.

Additionally, benefits, other advantages, and solutions to problems havebeen described with regard to specific embodiments. The benefits,advantages, solutions to problems, and any element or elements that maycause any benefit, advantage, or solution to occur or become morepronounced, however, are not to be construed as critical, required, oressential features or elements of any or all of the claims.

Moreover, embodiments and limitations disclosed herein are not dedicatedto the public under the doctrine of dedication if the embodiments and/orlimitations: (1) are not expressly claimed in the claims; and (2) are orare potentially equivalents of express elements and/or limitations inthe claims under the doctrine of equivalents.

1. A capacitor comprising: a substrate; a first electrically insulatinglayer over the substrate; a fin comprising a semiconducting materialover the first electrically insulating layer; a first electricallyconducting layer over the first electrically insulating layer andadjacent to the fin; a second electrically insulating layer adjacent tothe first electrically conducting layer; and a second electricallyconducting layer adjacent to the second electrically insulating layer.2. The capacitor of claim 1 wherein: the capacitor comprises adecoupling capacitor.
 3. The capacitor of claim 1 wherein: the capacitorcomprises a tri-gate storage capacitor.
 4. The capacitor of claim 3wherein: the first electrically insulating layer comprises an oxidelayer having a first surface; the fin is a silicon fin having a firstportion extending into the first electrically insulating layer andhaving a second portion protruding from the first surface; and thesecond electrically insulating layer comprises a high-k dielectricmaterial.
 5. The capacitor of claim 4 wherein: the first electricallyconducting layer comprises a first section at a first side of thesilicon fin and a second section at an opposing second side of thesilicon fin; a distance between an outside edge of the first section andan outside edge of the second section is a first distance; the secondportion of the silicon fin has a second surface; a distance between thefirst surface and the second surface is a second distance; and thesecond distance is between approximately six times the first distanceand approximately twelve times the first distance.
 6. The capacitor ofclaim 5 wherein: the second electrically conducting layer has a thirdsurface; a distance between the second surface and the third surface isa third distance; and the third distance is at least approximately equalto the first distance and as large as approximately twice the firstdistance.
 7. The capacitor of claim 1 wherein: the first electricallyinsulating layer comprises a first electrically insulating material; thefirst electrically conducting layer comprises a first electricallyconducting material; and the first electrically conducting materialcomprises a metal having a work function that lies approximately mid-waybetween a conductive band and a valence band of the first electricallyinsulating material.
 8. The capacitor of claim 7 wherein: the secondelectrically conducting layer comprises the first electricallyconducting material.
 9. A method of increasing a capacitance area of atri-gate memory cell, where the tri-gate memory cell comprises asubstrate, a first electrically insulating layer over the substrate, anda tri-gate capacitor and a tri-gate transistor over the firstelectrically insulating layer, and where the tri-gate capacitor has afirst semiconducting fin, the method comprising: depositing aninter-layer dielectric over the first electrically insulating layer andaround the tri-gate capacitor and the tri-gate transistor, theinter-layer dielectric having an inter-layer dielectric surface; forminga trench in the inter-layer dielectric in which at least a portion ofthe first semiconducting fin is exposed; conformally depositing a firstmetal layer over the inter-layer dielectric surface, in the trench, andover the first semiconducting fin; conformally depositing a secondelectrically insulating layer over the first metal layer; conformallydepositing a second metal layer over the second electrically insulatinglayer; and removing portions of one or more of the first metal layer,the second electrically insulating layer, and the second metal layer.10. The method of claim 9 wherein: the first electrically insulatinglayer comprises a first electrically insulating material; andconformally depositing the first metal layer comprises conformallydepositing a layer comprising a first metal having a work function thatlies approximately mid-way between a conductive band and a valence bandof the first electrically insulating material.
 11. The method of claim10 wherein: conformally depositing the second metal layer comprisesconformally depositing a layer comprising the first metal.
 12. Themethod of claim 11 wherein: conformally depositing the secondelectrically insulating layer comprises conformally depositing a high-kdielectric material.
 13. The method of claim 9 wherein: removingportions of one or more of the first metal layer, the secondelectrically insulating layer, and the second metal layer comprisescreating an upper extremity of the second electrically insulating layer;and the method further comprises recessing the second metal layer belowthe upper extremity of the second electrically insulating layer.
 14. Themethod of claim 9 further comprising: adjusting a height of the firstsemiconducting fin.
 15. The method of claim 14 wherein: a surface of thefirst electrically insulating layer is a first surface; the firstsemiconducting fin has a second surface and the second electricallyconducting layer has a third surface; a width of the trench is a firstdistance; a distance between the first surface and the second surface isa second distance and a distance between the second surface and thethird surface is a third distance; and adjusting the height of the firstsemiconducting fin comprises causing the height of the firstsemiconducting fin to be between approximately six times andapproximately twelve times greater than the first distance.
 16. Themethod of claim 9 wherein the first semiconducting fin is at leastpartially enclosed by an electrically conducting material and the methodfurther comprises: removing a portion of the inter-layer dielectric inorder to expose a surface of the electrically conducting material; andremoving the electrically conducting material in order to form thetrench.
 17. The method of claim 16 wherein: removing the electricallyconducting material comprises: depositing an electrically insulatingfilm over the inter-layer dielectric surface; defining an opening forthe tri-gate capacitor, thereby exposing a portion of the electricallyinsulating film; and removing the portion of the electrically insulatingfilm.
 18. The method of claim 17 wherein: removing the electricallyconducting material further comprises etching the electricallyconducting material using a wet etch.
 19. A system comprising: a board;a processing device disposed on the board; and a memory device disposedon and coupled to the processing device, wherein: the memory devicecomprises a capacitor comprising: a substrate; a first electricallyinsulating layer over the substrate; a silicon fin over the firstelectrically insulating layer; a first electrically conducting layerover the first electrically insulating layer and adjacent to the siliconfin; a second electrically insulating layer adjacent to the firstelectrically conducting layer; and a second electrically conductinglayer adjacent to the second electrically insulating layer.
 20. Thesystem of claim 19 wherein: the capacitor comprises a tri-gate storagecapacitor; and the memory device further comprises a tri-gate transistoradjacent to the tri-gate storage capacitor.
 21. The system of claim 20wherein: the memory device is a dynamic random access memory cell. 22.The system of claim 21 wherein: the second electrically insulating layercomprises a high-k dielectric material.